Performance
- Surface resistance
- Transparency & appearance
- Contact angle
- Adhesion
SEMICONDUCTOR ESD PROCESSING
Semiconductor ESD
Functional Surface Processing
From sample validation to repeatable production conditions.
Precision spray coating, dip coating and planar coating for semiconductor consumables, precision components, transparent substrates and complex workpieces.
- PROCESS
- Spray · Dip · Planar coating
- SUBSTRATE
- PET · PC · Engineering plastics · Metal
- DELIVERY
- Sample · Pilot · Production
PROCESS ENGINEERING
Process Control &
Production Consistency
We define controls for surface resistance, appearance, adhesion and batch consistency around the substrate, pretreatment, coating, drying and fixture conditions. Sample approval and process records support repeatable production.
Process
- Substrate pretreatment
- Coating & film thickness
- Drying & curing
- Fixtures & masking
Production
- Approved sample
- Batch parameters
- Inspection records
- Clean packaging
CORE PROCESS
Three Processing Platforms
The process is selected around workpiece geometry, substrate behavior, target performance and acceptance criteria.
01 / SPRAYING3D
Precision Spray Coating
Functional coverage for complex geometry, corners and selected areas with controlled film thickness, coverage and surface resistance.
- Workpieces
- Wafer carriers, fixtures, equipment parts
- Controls
- Path, fixture, masking and drying
02 / DIP COATING360°
Dip Coating
Continuous coating of inner and outer surfaces, grooves and tubular structures for special geometries and batch processing.
- Workpieces
- Tubular and special components
- Controls
- Viscosity, withdrawal speed and drying
03 / PRECISION COATING2D
Planar Coating
Uniform antistatic coating for flat substrates with balanced transparency, appearance and batch stability.
- Substrates
- PET / PC film, carrier tape
- Controls
- Uniformity, thickness and curing
APPLICATION SYSTEM
Semiconductor & Precision Manufacturing
Functional surface processing for risks related to charge accumulation, particle attraction and surface failure.
Explore Applications
Wafer Carriers
FOUP · FOSB · Cassette
Equipment & Fixtures
Engineering plastics · Precision parts
Electronic Packaging
IC Tray · Carrier Tape
Transparent Substrates
PET · PC · PMMA
PROCESS VALIDATION
From Specification to Production Baseline
Performance, appearance and process conditions are validated together to create a traceable project baseline.
Production Validation
- 01Define requirements
- 02Record conditions
- 03Reproduce results
Surface Resistance
Confirmed to project specifications
Contact Angle
Wetting and coating-property evaluation
Appearance & Adhesion
Haze, runs, scratches and adhesion
Safety Documents
SDS information aligned with GHS
PROJECT DELIVERY
Project Implementation Workflow
Requirements, process, validation and delivery conditions are established together.
- INPUT
- Substrate · Workpiece · Performance
- OUTPUT
- Process parameters · Acceptance baseline
- 01DefineMaterial · Geometry · Performance
- 02Select ProcessPretreatment · Coating · Drying
- 03Validate SampleAppearance · Resistance · Adhesion
- 04Pilot RunFixtures · Cycle · Packaging
- 05ProductionBatch parameters · Quality tracking
TECHNICAL INQUIRY
Start with the workpiece specification.
Share the substrate, drawing, target resistance, test method and estimated quantity.
Submit a Technical Request